Dear technetters, good morning,

Many board shops required microetch process, which is normal the
pretreatment/pre-cleaning of copper surface prior to subsequent chemical
processes. We have to control the etch depth, either from the spray system,
or the batch wise bath from autoplating line.  The desired etch depth
varies from process for process but ranging from 20-50 microinch.

We are using one sq. ft. bare board for the etch testing so that the etch
depth is calculated when we based on the fact that 1 microinch is 0.02g of
copper for one side.

We hope to collect ideas or  to gain your experience for getting this
results more wisely.  We tried of weighing the board, etch, clean and weigh
it again.  We are thinking to make some tools for this test so as to make
the control more easily. We hope to plate copper at a control thickness of
30 microinch and use this as a specimen for the control test or to find a
way telling the etch depth by co-relation.  We cannot consider the etch
chemicals condition since the batch wise and spray application are two
extremes.

Please kindly offer your ideas and chat.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################