Charlie,
        I did that about 3-4 years ago.  At the time we used a Qualitek
product and later switched to an Alpha WS619.  We used some convection
but mainly old IR (Vitronics 318) systems.  Our panels were also
standardized at 4.5x4.5 but were either 0.035" or 0.025" thick.  I'll
answer as much as possible.  If I don't have answers to all your
questions, I can suggest some other people to talk to at my old
employer.

Wade Oberle
414-947-3477


        -----Original Message-----
        From:   <Charles Barker> [SMTP:[log in to unmask]]
        Sent:   Tuesday, April 20, 1999 9:10 PM
        To:     [log in to unmask]
        Subject:        [TN] Reflowing ceramic boards.

        Is there anyone out there who has experience reflowing ceramic
boards in a
        forced convection oven using Sn96.5/Ag3.5 solder paste w/WS
flux?

        The boards I am working with are an array about 4.5" x 4.5" x
.040 thick
        with 16 each .6 x .6 daughterboards spaced out across the panel.

        I'd like a few minutes of phone time with someone who has had
experince
        profiling one of these. If you would care to send your phone
number, I'll
        give you a buzz.

        Thanks in advance.

        Charlie B.

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