Hi Dennis,

     Assuming that the remaining area is bare copper, you can overplate the
     entire pattern with tin/lead, then reimage to protect the features you
     want tin/lead, then solder strip the unprotected areas (selective
     solder strip).  Strip your resist, soldermask over the bare copper,
     then reflow.

     Hope this helps...Andy


______________________________ Reply Separator _________________________________
Subject: Re: [TN] Electrolytic plating on isolated areas or an altern
Author:  George Gerberick <[log in to unmask]> at smtplink-hadco
Date:    04/20/99 2:42 PM


What is on the balance of the circuitry? Can you electrolytic plate, dry film
mask and plate again in those
isolated areas before etch?

[log in to unmask] wrote:

> From: Dennis J Fall@TFT on 04/20/99 03:06 PM
>
> To:   [log in to unmask]
> cc:
> Subject:  Electrolytic plating on isolated areas or an alternative
>
> I have been pulling my hair out trying to figure out how to electroplate
> solder onto isolated areas (land pads, etc.).  I have also been trying to
> come up with other ways to do this (immersion, etc.).  I basically need
> about 5 ?m (0.2 mils) of solder.  Does anyone have any great ideas???????
>
> Thank You,
>
> Dennis Fall                        P: 507-625-8445 x17
>
> Engineer                           F: 507-625-3523
>
> Thin Film Technology Corporation         mailto:[log in to unmask]
>
> 1980 Commerce Drive                http://www.thin-film.com
>
> North Mankato, MN 56003-1702
>
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