Hi, sorry to get in between. You seem to discuss what is hot also here
at our company to and from. My first question would be: please,
gentlemen, what are you from Chuck and pupil? I have got some good
advice from Dave at Rockwell, maybe we have something good to learn
from you too. I have tried for one year to buy an american plasma
cleaner, but when the economists ask "what is the payback time" , then
what can I answer? Oh, my adrenaline...! /Regards
Ingemar Hernefjord
Ericsson Microwave Systems
> >Date: Tue, 20 Apr 1999 19:09:41 -0400
> >To: [log in to unmask]
> >From: joyce <[log in to unmask]>
> >Subject: Re: [TN] Wire Bonding On Gold
> >
> >(1) If you have good plating, you don't need any physical abrasion.
> >(2) you can use eraser if the surface of Au is not clean, but make
sure it
> has no/low ionics (such as Sulphur- common additive for rubber).
> >(3) you can use brush
> >(4) depend on your process and product, you may be able to use plasma
> too...However, if your plating surface required eraser to remove the
top
> surface, the plasma normally would not do the trick.. Plasma is great
to
> remove MINOR oragnic residue.
> >(5) if your gold is too hard (impurity or voids concentration are
high),
> you will have problem to bond and have reliability problem. (eraser,
brush,
> plasma are not going to help you).
> >good luck.
> >jk
> >At 06:29 AM 4/20/99 EDT, you wrote:
> >>We are presently wire bonding aluminum wire to gold lands on circuit
boards.
> >>I have heard many times that wire bonding goes sour to clean them
with an
> >>eraser. This seems a little primitive. Is there any other way that
this can
> >>be accomplished.
> >>If the eraser works why hasn't someone designed something to take
care of
> >>this.
> >>Chuck Garth
> >>
> >>################################################################
> >>TechNet E-Mail Forum provided as a free service by IPC using
LISTSERV 1.8c
> >>################################################################
> >>To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> >>To subscribe: SUBSCRIBE TechNet <your full name>
> >>To unsubscribe: SIGNOFF TechNet
> >>################################################################
> >>Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> >>For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> >>################################################################
> >>
> >
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text
> in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for
> additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700
> ext.312
> ################################################################
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
