>Date: Tue, 20 Apr 1999 19:09:41 -0400
>To: [log in to unmask]
>From: joyce <[log in to unmask]>
>Subject: Re: [TN] Wire Bonding On Gold
>
>(1) If you have good plating, you don't need any physical abrasion.
>(2) you can use eraser if the surface of Au is not clean, but make sure it
has no/low ionics (such as Sulphur- common additive for rubber).
>(3) you can use brush
>(4) depend on your process and product, you may be able to use plasma
too...However, if your plating surface required eraser to remove the top
surface, the plasma normally would not do the trick.. Plasma is great to
remove MINOR oragnic residue.
>(5) if your gold is too hard (impurity or voids concentration are high),
you will have problem to bond and have reliability problem.  (eraser, brush,
plasma are not going to help you).
>good luck.
>jk
>At 06:29 AM 4/20/99 EDT, you wrote:
>>We are presently wire bonding aluminum wire to gold lands on circuit boards.
>>I have heard many times that wire bonding goes sour to clean them with an
>>eraser.  This seems a little primitive.  Is there any other way that this can
>>be accomplished.
>>If the eraser works why hasn't someone designed something to take care of
>>this.
>>Chuck Garth
>>
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