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April 1999

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Apr 1999 22:51:22 -0500
Content-Type:
text/plain
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text/plain (75 lines)
Hi Kent - In terms of solderability requirements you could use
ANSIJ-STD-002A as your specification. Do you know what the metallization on
the resistors is? There are several different test methods within the
specification that can be used (Take a look and if you have additional
questions just shoot me an email). Good Luck.

Dave Hillman
JSTD-002A committee cochair
[log in to unmask]




"Kent S. Asmus" <[log in to unmask]> on 04/17/99 01:44:43 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Kent S. Asmus" <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] SMT Chip Resistors




All-

When sourcing precision thick-film SMT chip resistors with wrap-around
contacts, how does one typically control the quality of the delivered
product; i.e., contact solderability, contact integrity, etc? In other
words, what is the industry standard specification(s) that are typically
called out for such components? What is the appropriate IPC or EIA
standard?
I am also interested in finding out what tests can be conducted to
determine
the solderability of wrap-around contacts on SMT chip resistors.

I'm currently experiencing contact dewetting during reflow on about 20% of
the resistors obtained from a particular manufacturer. There also appears
to
be a significant number of chips with cracks in the wrap-around contacts.

Thanks in advance for any information you may be able to provide.

Regards,

Kent
[log in to unmask]

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