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April 1999

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Subject:
From:
"<Charles Barker>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Apr 1999 21:09:49 -0500
Content-Type:
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text/plain (26 lines)
Is there anyone out there who has experience reflowing ceramic boards in a
forced convection oven using Sn96.5/Ag3.5 solder paste w/WS flux?

The boards I am working with are an array about 4.5" x 4.5" x .040 thick
with 16 each .6 x .6 daughterboards spaced out across the panel.

I'd like a few minutes of phone time with someone who has had experince
profiling one of these. If you would care to send your phone number, I'll
give you a buzz.

Thanks in advance.

Charlie B.

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