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Subject:	Re: Electrolytic plating on isolated areas or an alternative
From:	George Gerberick <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 20 Apr 1999 14:42:46 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

What is on the balance of the circuitry? Can you electrolytic plate, dry film mask and plate again in those
isolated areas before etch?

[log in to unmask] wrote:

> From: Dennis J Fall@TFT on 04/20/99 03:06 PM
>
> To:   [log in to unmask]
> cc:
> Subject:  Electrolytic plating on isolated areas or an alternative
>
> I have been pulling my hair out trying to figure out how to electroplate
> solder onto isolated areas (land pads, etc.).  I have also been trying to
> come up with other ways to do this (immersion, etc.).  I basically need
> about 5 ?m (0.2 mils) of solder.  Does anyone have any great ideas???????
>
> Thank You,
>
> Dennis Fall                        P: 507-625-8445 x17
>
> Engineer                           F: 507-625-3523
>
> Thin Film Technology Corporation         mailto:[log in to unmask]
>
> 1980 Commerce Drive                http://www.thin-film.com
>
> North Mankato, MN 56003-1702
>
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