TECHNET Archives

April 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Apr 1999 15:06:49 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
From: Dennis J Fall@TFT on 04/20/99 03:06 PM


To:   [log in to unmask]
cc:
Subject:  Electrolytic plating on isolated areas or an alternative

I have been pulling my hair out trying to figure out how to electroplate
solder onto isolated areas (land pads, etc.).  I have also been trying to
come up with other ways to do this (immersion, etc.).  I basically need
about 5 ?m (0.2 mils) of solder.  Does anyone have any great ideas???????

Thank You,

Dennis Fall                        P: 507-625-8445 x17

Engineer                           F: 507-625-3523

Thin Film Technology Corporation         mailto:[log in to unmask]

1980 Commerce Drive                http://www.thin-film.com

North Mankato, MN 56003-1702

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2