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April 1999

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Subject:
From:
"Alderete, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Apr 1999 08:04:12 -0700
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James-

I. Turlik, et al, published a number of papers which include the area of
interest, in IEEE Trans. CPMT.

One article readily available to me is as follows:

IEEE CPMT, Vol. 16, No. 1, February 1993, "Passivation Schemes for
Copper/Polymer Thin-Film Interconnections Used in Multichip Modules," by
Gretchen Adema, L.-T. Hwang, Glenn Rinne, & Iwona Turlik [all MCNC, North
Carolina, USA, pp. 53-59, with [25] references cited.

An excerpt from the Abstract:

"An investigation was conducted to examine the use of inorganic dielectric
films as barrier layers between copper and polyimide..."

Hope this helps.

Michael Alderete
Aerojet


-----Original Message-----
From: James Rohan [mailto:[log in to unmask]]
Sent: Monday, April 19, 1999 3:27 AM
To: [log in to unmask]
Subject: [CHIPNET] Metal Polyimide Adhesion


Does anybody have specific information about the reaction of copper with
polyimide which leads to adhesion failure? Does this failure occur in the
different instances of polyimide on metal and metal deposition on cured
polyimide?
and
we would like information on the interaction of nickel and/or copper with
fully cured photo spin-on polyimide and how the adhesion of either of these
metals to the polyimide might be improved?

Thanks,

James

__________________________________
James Rohan
National Microelectronics Research Centre
Lee Maltings
Prospect Row
Cork
Ireland

Tel.    + 353 21 904224
Fax.    + 353 21 270 271
http://www.nmrc.ucc.ie

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