IPC Chip Scale and BGA National Symposium:
The Pursuit of the Perfect Package
Santa Clara Convention Center, Santa Clara, California
Workshops - May 5, 1999
Tabletop Exhibits and Technical Conference-May 6-7, 1999
Popularity Pains?
The now inevitable movement of Chip Scale and Ball Grid Array packaging into the
electronics manufacturing infrastructure is a battle fought on many fronts. It is, as
Eric Bogatin, Bogatin Enterprises, describes it, "an incredibly interdisciplinary
field" where package designs, substrates, assembly process, test and inspection all
interrelate. The continued popularity of these high density component packages is
dependent upon a "meeting of the minds" of the semiconductor manufacturer, the
packaging technologist, the printed board fabricator, the assembly engineer, and many
others. Now is not the time to mind your own business!
The 1999 IPC Chip Scale and Ball Grid Array National Symposium will present new
substrate technology, wafer level processes, PCB design strategies, assembly and
reliability data. Critical issues, such as package design for test and BGA solder
joint reliability, will be explored. An OEM Applications Forum will show where CSP is
headed in both market and technological terms.
OEMs and everyone involved in manufacturing or supplying to the CSP/BGA assembly
industry must attend this symposium. Tabletop exhibits will showcase the latest in
equipment and material innovations for BGA and CSP. Workshops on May 5th will provide
a more in-depth treatment of topics from substrate determination to CSP assembly
reliability.
If your company is interested in exhibiting at the IPC Chip Scale Ball Grid Array
National Symposium, please contact Page Hecker at 510-797-5517. Tabletop space is
limited. The tabletop exhibit fee includes admission for one to the technical
conference.
FOR A COMPLETE CONFERENCE AND WORKSHOP BROCHURE OR REGISTRATION INFORMATION, call
Alex Curtis at 847-790-5377. Or, see our brochure on IPC's website (click on the
link from the conference listing on the calendar May 5-7, 1999).
Maryellen Hilderbrand
Education Manager
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone: 847.790.5382
Fax: 847.509.9798
E-mail: [log in to unmask]
URL: http://www.ipc.org
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