All-

When sourcing precision thick-film SMT chip resistors with wrap-around
contacts, how does one typically control the quality of the delivered
product; i.e., contact solderability, contact integrity, etc? In other
words, what is the industry standard specification(s) that are typically
called out for such components? What is the appropriate IPC or EIA standard?
I am also interested in finding out what tests can be conducted to determine
the solderability of wrap-around contacts on SMT chip resistors.

I'm currently experiencing contact dewetting during reflow on about 20% of
the resistors obtained from a particular manufacturer. There also appears to
be a significant number of chips with cracks in the wrap-around contacts.

Thanks in advance for any information you may be able to provide.

Regards,

Kent
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