Hey, Jorge: I believe that the major Japanese manufacturers (Sony/Toshiba
etc.) have been using 0201's for at least two years. I did a paper at
NEPCON West this year with Plexus Corp on the process parameters needed for
0201 implementation, and the major factors affecting tombstoning of these
were:

- Pad design (keep 'em short)
- Paste powder size (size 4 is preferred over size 3)
- Profile (single profile with a long preheat is best)

If you're interested, the paper was "Tombstoning of 0402 and 0201
Components..." by Yuen et al. There is some evidence that placement
accuracy has a big effect on the degree of tombstoning, but we did not do
any studies of this.

Andy Mackie, PhD (Chairman - IPC Solder Paste Task Group)
Praxair Inc.
777 Old Saw Mill River Road
Tarrytown
NY 10591
Ph: 914-345-6402
Fx: 914-345-6405





Jorge Engenharia <[log in to unmask]> on 04/16/99 12:18:36 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Jorge Engenharia <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Andy Mackie)
Subject:  [TN] 0201 component size usage




  Hi techs,

  I am doing a increase capacity study at our SMD area and some
placement machines are 0201 capable and some don't.
  What is happening in the rest of the world, 0201 is already a reality?
  0201 capability must drive my choice ?

  We assembly computers and related boards ( fax-modem, vga, audio,etc
.. )

  Any comments will be apreciated ...

Jorge Santana
Process / Maintenance Engr
Microtec - Brazil

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