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Subject:	Re: Assembly process differences between HASL and nic/gold surface finishe
From:	David D Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 15 Apr 1999 13:13:01 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (65 lines)

Hi TechNet! Oops - one too many Pepsi's today - the year for the reference
below is 1999.

Dave Hillman
Rockwell Collins
[log in to unmask]
---------------------- Forwarded by David D
Hillman/CedarRapids/Collins/Rockwell on 04/15/99 01:09 PM
---------------------------


"Maguire, James F" <[log in to unmask]> on 04/15/99 12:28:19 PM

To:   David D Hillman/CedarRapids/Collins/Rockwell
cc:
Subject:  RE: [TN] Assembly process differences between HASL and nickel
               /gold             surface finishe




Dave,

What year is that Expo proceedings?
---------------------------------------------------------
Jim Maguire
Boeing Phantom Works



> Subject:     Re: [TN] Assembly process differences between HASL and
nickel             /gold             surface finishe
>
> Hi Gerry - I suggest that you take a look at  the following paper:
>
> "The Root Cause Failure Mechanism for Solder Joint Integrity of
Electroless
> Nickel/Immersion Gold Surface Finishes", Nicolas Biunno, IPC Expo
> Proceedings, paper S-18-5
>
> There have been some instances where the Immersion Au/ Electroless Ni has
> been a problem finish for some assemblers. The paper details some
possible
> reasons for those reported problems.  I have not experienced any problems
> with the use of Immersion Au/ Electroless Ni finishes but I am also using
> it in some very specific product applications. The Immersion Au/
> Electroless Ni is very flat thus making placement of fine pitch and area
> array components much better than a HASL finish. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]

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