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April 1999

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Apr 1999 06:53:16 -0500
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Hi Jim - I have used  impedance spectroscopy techniques to evaluate a
potential solder paste candidate and as a method of process control. The
test is very easy to conduct but you do need to have a good understanding
of how to generate a equivalent circuit model for the solder paste you are
testing and you do need to build up a use history to understand how the
modeling relates to manufacturing problems. The folks at ACI/EMPF in
Philadelphia are a good source of info (contact Greg Brobjorg at
610-362-1200, ext. 218 for more info on both the technique and equipment)
or shoot me an email with more specific questions. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





Jim Kittel <[log in to unmask]> on 04/14/99 04:02:37 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to [log in to unmask]

To:   [log in to unmask]
cc:
Subject:  [TN] Impedance Measurements of Solder Paste




Technetters:
Is anyone using impedance measurement as a process control in their
manufacturing area?  I have a copy of a paper from the EMPF published in
the April/97 edition of 'Assembly' and it describes this process.  Looks
like an easy way to characterize paste.  Anybody using this technique to
identify bad paste?

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