Hello all,

We are seeing some soldermask coming off the board during
assembly which exposes the copper.  The size is relatively small at
about 20-mils square, the location about 40-mils from the edge, and
located on a ground plane.  We think we know what's causing it, but my
question deals with rework.

Two options have been presented:
1)  Apply new soldermask and cure.  Seems reasonable, but the customer
doesn't like the appearance.
2)  Apply solder and clean.  There may be an issue with applying
enough heat to get good wetting and too much heat resulting in
damage, especially considering it's a ground plane.

Anyone know of a specification issue why either option can't be done?
 Any experiences, good or bad?

Thanks for all your help, today and in the past.

Glenn
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