We are PCB manufacturer.  We only perform the test before the wave
soldering and then subsequently ship to our customers.  We have no way to
assure the adhersion properties after they stuffed the boards and undergo
wave soldering.  Especially for tin-lead reflow boards, tape test will
definitely fail after wave soldering.

I suppose the essence for the function of solder mask is simply to be a
protect mask for soldering, that it.



At 10:49 AM 1999/4/14 +0300, Babis Papadias wrote:
>Hello
>
>IPC-TM-650 suggests that the solder mask adhesion test (tape test) should
>be performed before and after wave soldering test.
>Could you please inform me why should the test be performed after wave
>soldering test i.e. in what way will the PBA's performance be jeopardized
>due to poor solder adhesion  evidenced for example by  solder mask peel off
>(after wave soldering).
>
>Thank you in advance.
>D. Grafanakis
>Athens, Greece.
>e-mail: [log in to unmask]
>
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