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April 1999

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Subject:
Solder Mask Adhesion (Tape test)
From:
Babis Papadias <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Apr 1999 10:49:07 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines) 
Hello

IPC-TM-650 suggests that the solder mask adhesion test (tape test) should
be performed before and after wave soldering test.
Could you please inform me why should the test be performed after wave
soldering test i.e. in what way will the PBA's performance be jeopardized
due to poor solder adhesion  evidenced for example by  solder mask peel off
(after wave soldering).

Thank you in advance.
D. Grafanakis
Athens, Greece.
e-mail: [log in to unmask]

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