Hi TechNet,

We have a small multilayer (4, I think) GFG board which has 8 pressfit, flared terminals installed along one edge, about 0.25" from the edge of the board.  After wave solder,  these boards are being rejected for measling around the hardware - typically between two terminals.  The measling was either not present before solder or was made more apparent by the wave solder temperatures.  The hardware is the correct size for the board thickness and hole size & is being installed using the manufacturer's tool.  We did not observe this problem in previous batches but the board material has been changed from FR4 to GFG [should have helped, I'd think].  Is it possible we are doing mechanical damage to the boards during flaring?  Thanks in advance for your help!

Sheila Smith, Marconi Aerospace

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