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April 1999

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Subject:
From:
Roger Massey-G14195 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Apr 1999 16:27:52 +0100
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     Scott,
     
        Initially, it sounds like a candidate for Cu diffusion through the 
     Ni to the surface, especially as you say that you were finding trace 
     amount of copper in the bad connectors, and that those bad parts have 
     a thinner plated layer.  However, do you have the facility to look at 
     the surface with something like an AES (Auger Electron Microscope), 
     XPS (Xray Photo Spectrocopy, (sometimes called ESCA)) or any of the 
     other low penetration techniques?  
        In a previous job I used to get a similar problem, with parts being 
     returned for a black layer over the complete Ni-P plating (I thought 
     it kind of pretty but the customer did'nt agree) and these parts could 
     be returned from anything within 2 days to 10 months.  This drove me 
     nuts for almost 4 months as I could find no obvious reason, At first 
     glance SEM/EDX showed that there was a trace of Cu in the bulk plated 
     layer, and I immediatly jumped at the Cu diffusing through and 
     oxidising.  I increased the plating layer, to increase the diffusion 
     distance as this effectively removed the Cu and I still got a problem 
     when running trials. Management were unwilling to spend the money on 
     some serious analysis so the problem continued until it suddenly 
     stopped, it was subsequently assumed that it was related to the DBC 
     batches as the problem stopped when the batch ran out, but it returned 
     4-5 weeks later.  
        I could go on for hours about the trials ran on this, but the crux 
     of it was that the DI water in the final rinse stage was reacting with 
     Ni-P layer.  I used to live in the North East of the UK where the 
     water is real hard (Calcium etc), and ion exchange columns in the DI 
     plant used to last three weeks and not the predicted 6 months. Due to 
     the crap logistics from our materials guys, I eventually found that we 
     had to run exchange columns for a couple of weeks after their normal 
     replace time, and that we were washing in a mildly corrosive DI water. 
      This was attacking the Ni-P and subsequently leaving it open to 
     attack during service.  If the ion columns are old enough you can wash 
     a clean Ni-P layer and make it go black immediatly!  
     
        I dont know if this is the same thing for you, but, take a look at 
     the quality of the DI in your tanks, and the frequency of the ion 
     columns changes, see if there is a pattern with the occurance of the 
     problem.  A chemist friend said that it could be sulphides on the Ni 
     making the black tarnish, so the low penetration analysis techniques 
     could pick them up, or at least indicate other possible sources  
     (failing that, tell the customer its a cosmetic feature at no extra 
     cost, the random nature nature could make it a kind of collectors 
     edition, and actually increase sales)
     
           Good luck
     
                Roger
     
     (PS. Mr Fenner, the joys of the old days while working at the "Wely", 
     alas sadly no more)
     
     Roger Massey
     Materials Technologist - Europe
     Motorola AIEG
     


______________________________ Reply Separator _________________________________
Subject: [TN] Oxidation on a Connector
Author:  "TechNet E-Mail Forum." <[log in to unmask]> at #email
Date:    12/04/99 09:02


Hi All,
 
We have a BNC connector that is put through reflow and wave solder with 
water washes after each soldering operation.  The customer has been 
returning some product because the BNC connectors are turning black in 
the field.  
 
Cross-sectional and SEM/EDS analysis show that the connector has a 
ferrous base-metal with copper overplate.  Nickel is plated on top that 
contains about 5%phosphorous.  The "bad" connectors have a Ni thickness 
of 0.1mil and the "good" connector has Ni thickness of 0.2mil.  A trace 
of copper was detected on the "bad" connectors (about 1%).   
 
What could be causing the black oxide?  Could it be copper oxide from 
solid state diffusion of the copper through the nickel barrier?  Other 
ideas?
 
Some of the units were in the field for 6 months to a year. 
 
Thanks
Scott
 
************************************************************************ 
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Scott M. Severson                      
QA/FA Lab Manager                                            "Space and 
Time
                                                              are not 
conditions in which we live, 
Benchmark Electronics Inc.                         but modes in which we 
think."     
4155 Theurer Blvd.                       
Winona, MN
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