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April 1999

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Apr 1999 11:02:05 +0200
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I have a question about double sided reflow of plastic BGA's : 

We start with baking the BGA's at 125 degrees Celcius for 24 hours (except when they come from a sealed dry-pack bag, of course)
After the first soldering step, the boards are cleaned, rinsed (spraying hot water over the boards for about 30 minutes), and dried at 70 degrees Celcius for 30 minutes.
My question is wether the boards should be baked again prior to assembly of the second side, to get rid of absorbed water from the washing-operation. So far I haven't seen any "popcorn effect", but I'd like to hear what other people are doing.

Daan Terstegge
Signaal Communications
Unclassified 

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