TECHNET Archives

April 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Baking of polyimide boards
From:
"Mengers, William D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Apr 1999 16:02:24 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines) 
Guys (and girls),

Can anyone tell me whether or not polyimide boards need to be pre-baked
before processing thru nitrogen reflow for solder melt?  We are doing it,
which of course means added expense.  Is it really necessary?  We bake at
110 C for four hours.  Is there evidence which suggests that it is
necessary.

Thanks for any replies,

Bill Mengers
Northrop Grumman Corp.
Baltimore, Md.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2