To add to Mike reply:

Ceramic packages are multilayer packages witn end termination as surface
coating - usually Cu-Ni-Gold . To the surface termination. Leads are brazed
to make it similar to DIP Ics. Usually they cost 20 times DIP eqvt IC cost -
but are hermetic and more reliable in case of high thermal disssipation
requirements. Another type Cerdip might cost 7-10 times plastic packages .

Now, if termination metallisation appear on side (thickeness) of package .
leads are run soldered on side . No forming of leads required.
If metallisation appear onto top of package , the leads are run flat ,
brazed and formed to give shape like DIP IC. This package tend to be wider
than standard Side brazed package.Bottom brazed will be opposite to top
brazed packages.

For foot print, suggest you to refer to SEMI Standards or refer to data book
on Global source e.g. National Semiconductor, AMI, Harris, etc.

Hope this will add to what Mike already explained.

Note:

There is an intermittent type of IC - called cerdip with glass seal instead
of multilayer cermamic. You can imagine this as top and bottom halves of
plastic body and leadframe as third element. The LF is attached to bottom
half- lead frame sink into glass. Carry our Die attach , wire bond . Now
flip top half onto it and run through oven to complete sealing.


Ashok Dhawan P.Eng
Unisys Canada Inc.
51 Burmac Road
Winnipeg  R2J 4C9
Canada

Fone: (204) 257 9199
Fax : (204) 257 9104
E-mail: [log in to unmask] <mailto:[log in to unmask]>



-----Original Message-----
From:   [log in to unmask] <mailto:[log in to unmask]>
[SMTP:[log in to unmask]] <mailto:[SMTP:[log in to unmask]]>
Sent:   April 3, 1999 2:00 PM
To:     [log in to unmask] <mailto:[log in to unmask]>
Subject:        Re: [TN] DIP components

In a message dated 03/04/99  10:05:05AM,  [log in to unmask]
<mailto:[log in to unmask]>  writes:
>  Dear Technetters
>  Has anyone heard about something called side braze DIP or bottom brazed
>  DIP? What does it mean?
>  Is there a physical difference in the size between a plastic DIP and a
>  ceramic DIP, i.e. is there a difference in the footprint.
>  --
>  Best Regards                                       ""
>  Khaled H. Fouad
++++++++
These go back to when I had hair.
DIP or  these days DIL = Dual In line Package.
Originally the body of multileaded devices, ICs etc, was made from ceramic
and the metal leads were attached by brazing either to the sides or the
bottom. [This technology is still used on very high reliability or low run
or high power products (eg space or Mil) and a common application still is
ceramic PGAs.]
When plastic bodied devices were introduced they were footprint compatible
with the ceramic packaged parts, usually with a slightly smaller body.
NOTE: If you are looking at old products the major change between then and
now is that these were THROUGH HOLE devices not SMT and the leads are 0.010"
pitch,
If you go very far back it is not possible to state with 100% certainty that
they will all be compatible. However it is reasonable to assume that if you
have say a 16pin DIL in ceramic that it will have the same footprint as a 16
pin plastic device.
Mike Fenner

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