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April 1999

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Mon, 12 Apr 1999 16:26:18 GMT
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Can someone help with the processing of a heavily populated SM PCB,
SM top and bottom which has to be reflowed both sides and has through
holes parts ( no wave solder ).

Any guidelines on how this should be processed would be of great
help ie what side is the high temp solder used on, most densly least
densly populated etc etc.

Regards,
ken Robertson
Telspec

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