Hi folks

I have this "Adverse Effect" puzzle from last CE plant ispection ; stating
we don't have validated the adverse effect of repairs ;
which unfortunately I could not argue about (this inspectors are getting
wiser every year !)

Now, before I'll scrap all the soldering irons and insist on thermal
profiles at all stages ; which is kind of radical ;
and introduce hot air jets with validated thermals ; which is kind of over
the top ;
or design it all in on p&p ; which will take time :
how do you folks address the fact we have perfectly tuned reflows and than
on the second stage we shock anything else with 0-300'C instant ? Ok ; I can
have the hotplates ; etc.; but did anybody attached thermocouples to the
manually handled component monitored throughout the process ; and
crosslinked those thermals with those specified by component manufacturer
(some caps do have very specific raise) ; flux activation recommendations ;
etc. ?
This is mainly SMD's issue ; the T/H parts with legs to dissipate the first
shock up to a degree are bit easier subject .

Thanks a lot for the help

Paul Klasek
http://www.resmed.com

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