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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 5 Apr 1999 16:57:38 -0500 |
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I would like to echo Nick's question, and add to it if I may:
What diameter vias are you using out there? We recently used .026" on
a surface-mount-both sides (reflow/reflow) product that has a ton of
via's, and the PWB vendor did a 2nd fill with an LPI solder mask
(tented via), but the fill was too tall for us to print the solder
paste on the rear side of the board (BIG PROBLEM-O, CAN YOU SAY
NON-CONTACT PRINTING?) We have discussed going to .018" diameter vias
to aid in tenting with one pass with the LPI soldermask....any
suggestions out there, please???
______________________________ Forward Header __________________________________
Subject: [TN] Solder filled vias
Author: Nick Nicolaides <[log in to unmask]> at Internet
Date: 4/5/1999 5:16 PM
Recently one of our PCB houses has shipped boards with the VIAS
filled with
solder. Generally per IPC600, it states that VIAS other than blind
or buried
can be solder masked or solder (coated). Since this area is quiet in
the IPC
or J-Standards, what is your take on this. In addition on the same
boards we
see both solder mask and solder filled.
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