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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 16 Apr 1999 10:14:40 +0200 |
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Hello Dave,
is it possible to get a copy of these pages? What you describe seems to
be what we experience just now when we solder a ceramic filter on a
organic board with a heave brass backside. See attached files that you
can open in Adobe Photoshop.
I have also another delicate question for you as a TechNet guru: how on
earth do you He-test a large LTCC MCM with a soldered-on CuMo plate,
with soldered-on coax contacts outside the large sealframe, and also som
tantalum caps, also mounted on outside of the frame. All these outer
components together with the porous LTCC hides a lot of Helium and makes
the test a mess. The packages are laser seamwelded and He-bombed
afterwards. We have also tried to trim the He tester for a Nitrogene
peak instead, but with no useful result. Do you have any idea?
Finally, what is your e-mail adress for sending attachments directly to
you? [log in to unmask] does not work.Nor does 'dhillman...'
Regards /Ingemar Hernefjord
Ericsson Microwave Systems
> Hi Stephen - for additional info on grainy joints take a look at the
> following reference:
>
> "The Rough or Grainy Solder Phenomenon", R. Bulwith, PC Fab, October
1986,
> pages 23-35.
>
> In many cases a grainy solder joint is a cosmetic problem only. Good
Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
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