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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 14 Apr 1999 09:17:54 -0700 |
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In the old days when we used the aqueous flux wave soldering process, we
experienced flux entrapment underneath the bad soldermask (even on SMOBC board)
and led to electromigration across traces. For a while we did tape test after
wave. I can't be sure if no-clean process are more forgiving.
Hope it helps.
K.K. Chin
Artesyn Technologies
Fremont,CA
www.artesyn.com
Babis Papadias <[log in to unmask]> on 04/14/99 12:49:07 AM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
Babis Papadias <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: KK Chin)
Subject: [TN] Solder Mask Adhesion (Tape test)
Hello
IPC-TM-650 suggests that the solder mask adhesion test (tape test) should
be performed before and after wave soldering test.
Could you please inform me why should the test be performed after wave
soldering test i.e. in what way will the PBA's performance be jeopardized
due to poor solder adhesion evidenced for example by solder mask peel off
(after wave soldering).
Thank you in advance.
D. Grafanakis
Athens, Greece.
e-mail: [log in to unmask]
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