Hello
IPC-TM-650 suggests that the solder mask adhesion test (tape test) should
be performed before and after wave soldering test.
Could you please inform me why should the test be performed after wave
soldering test i.e. in what way will the PBA's performance be jeopardized
due to poor solder adhesion evidenced for example by solder mask peel off
(after wave soldering).
Thank you in advance.
D. Grafanakis
Athens, Greece.
e-mail: [log in to unmask]
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