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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 12 Apr 1999 12:28:51 -0400 |
Content-Type: | text/plain |
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Can anyone outline the advantages and disadvantages of using broadside coupled
vs. edge coupled differential traces? Is either one better from a signal
integrity perspective ( less lossy? lower crosstalk?). Is it easier to route
broadside coupled traces in high density applications? And what are the issues
board manufactures need to deal with such as tolerances, trace registration,
impedance control, number of layers, etc.? Any insight you can provide would be
helpful. Thanks!
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