Dear Technetters,

     Calling all you experts out there, can anyone tell me in which area of
     the BGA/CSP assembly process does manufacturers experience
     defects/faults.What are the common faults which BGA manufacturers
     concerns?

     Thank you all for your kind attention.

     example of a BGA assembly process:

     1)substrate__2)die-attach__3)wirebonding__4)encapsulation__5)marking__
     6)singulation__7)flux-print__8)ballplacement__9)reflow/ballattach__10)
     cleaning__11)packaging.

     Best Regards,
     Lawrence Yeo

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