In a message dated 3/4/99 6:05:35 AM Pacific Standard Time, GCAMAC@dickey-
john.com writes:

<< Steve,

 Your responce to this question brings a question to my mind.  Why wouldn't I
want to use the surface area
 of the lead or electrod as that is wetted surface that is supporting the
component's weight.  Perhaps the use of pad surface has been empirically
established as a close equivalant, you know one of those Rule of Thumb deals,
it ain't science but it sure works.

 Gary Camac >>

Hi Gary,

    Yeah, when I first heard that formula, I was thinking the same thing. But
was told that it's easier to figure the surface area of the pads than it would
be to try and figure the foot of the leads surface area...how would you go
about that on J-leaded parts? The solder wicks up to certain height and I
imagine how far that would be comes into the equation...it's probably just
splittin' hairs anyway. Kinda' like they say about horseshoes and hand
grenades; "All ya' gotta be is close"...hehehe

-Steve Gregory-

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