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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 3 Mar 1999 10:04:17 -0600 |
Content-Type: | text/plain |
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John,
I assume you want to use these for some sort of through-hole
reflow application, like pin header soldering. Many solder preform
vendors make doughnuts held together with a very small solder rib
between the doughnuts that separates during reflow. This eliminates the
kapton requirements and additional costs/handling.
Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX 77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]
> -----Original Message-----
> From: Arroyave, John (FL51) [SMTP:[log in to unmask]]
> Sent: Wednesday, March 03, 1999 8:40 AM
> To: [log in to unmask]
> Subject: [TN] Any Info on Solder Preforms with 0.100" centers
> held together by Kapton?
>
> Does anyone know of a manufacturer or vendor that may make or sell
> this
> product, if it exists? We are basically looking for individual
> preform
> "doughnuts" that are held in place by Kapton or some other similar
> material,
> that can be removed after re-flow. I looked into Winslow Automation's
> SolderQuick product, but apparently they only do re-balling for BGAs
> on
> Kapton like material. Any information would be greatly appreciated.
>
> Thanks,
>
> John Arroyave
> SMT Production Engineer
> Honeywell Space Systems
> Phone: (727) 539-2272
> Fax: (727) 539-4469
> e-mail: [log in to unmask]
> <mailto:[log in to unmask]>
>
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