- Regarding chips on their side (or inverted).   Seems to me that chips on
their side (aka billboarding) is allowed up to 5 times per pwa (see page 129
of IPC-A-610B) as long as they are adjacent to taller components (presumably
to protect the mechanically weaker connection from stress by handling).  I
guess you can have as many as you want if you pencil it onto the drawing.
Some folks claim that they billboard chips to achieve more effective cooling.
Inverted chips, at least those with precision/laser cut values, are usually
prohibited on class 3 (hi-rel) assemblies (seems like folks want the precision
trimmed area topside).
- Regards, Jim Moffitt

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################