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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 3 Mar 1999 07:56:32 -0500 |
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Howard,
It is certainly possible to electroplate hard gold over immersion
gold, obviously provided that the features to be hard gold are bussed
in some manner. The remainder of the board would be appropriately
masked off using a photoresist that only exposed the features to be
plated, just like other selective plating operations. The real key is
sufficient stripping of the resist and subsequently removing residual
organics from the immersion gold features to allow acceptable wire
bonding. Generally a soap cleaner, such as one would find at the
start of a pattern plate process, will start this cleaning process.
Clean rinsing and drying are important. Follow this with a plasma
oxygen burn.
Hope this helps...Andy Slade
______________________________ Reply Separator _________________________________
Subject: Re: [TN] Two kinds of surface finish
Author: Paul Wilson <[log in to unmask]> at SMTPLink-Hadco
Date: 03/03/99 6:18 AM
Howard,
It might be that the reverse order of application would be acceptable for a wire
bond?
Is this an "all gold board"?
The tab plater would likely sheer the immersion gold off anyway?
Paul Wilson
R&D Manager / Plant Chemist
Circuit Center, Inc.
4738 Gateway Circle
Dayton, OH 45440
Phone (937) 435-2131 Fax (937) 435-7698
http://www.circuitcenter.com
-----Original Message-----
From: Howard Lin [SMTP:[log in to unmask]]
Sent: Wednesday, March 03, 1999 12:07 AM
To: [log in to unmask]
Subject: [TN] Two kinds of surface finish
Dear All,
I got one inquiry from our customer on two kinds of surface finisf for
one board. They need both immersion gold and hard gold plating. Can I
dirctly apply hard gold plating over immersion gold on gold finger area?
Is there any quality issue that I should concern?
I am very appreciated for any input.
Regards,
Howard
Maxedge Electronic Corp.
[log in to unmask]
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