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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 3 Mar 1999 07:09:30 EST |
Content-Type: | text/plain |
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Hi Earl,
While I have not looked at the dimmensions of 0402 vs. 0603's, I certainly
agree with the philosophy for glued chip components. My previous response did
not consider glued components; for glued components the solder joint 'gap' is
assured to be larger, reducing the thermal expansion mismatch strain on the
solder joint and increasing reliability; and the near absence of fillets
prevents component cracking.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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