Hi Stella,
Sorry I am responding so late to this, but I was of babysitting my two
granddaugthers and away from the web.
You do not give any details (FR-4 substrate? under-hood environment), but in
any case the fillets at the end caps are far less important than the solder
joints in the gaps between the RC metallizations and the the PCB soldering
pads.
The solder joint failures always start underneath the RCs in the 'gap' solder
joints; when that has essentially completely cracked the crack continues to
propagate through the fillet at an angle of 45 degrees or steeper (closer to
the end cap) depending on the fillet shape (concave=>45 degrees). The solder
joint hangs on be the not completely fractured fillet.
Everything  else being equal, missing end fillets may reduce time to complete
fracture to one half.
However, it is likely, that the solder paste caused the 0805's to swim up on
the 0603 pads thereby increasing the thickness of the 'gap' solder joints. The
fatigue life increases with roughly the square of the thickness of the 'gap'
solder joints; thus, if your gap has increased lets say from 2 to 2.8 mils,
you about doubled the life offsetting the effect of the fillets.
Side fillets have no effect.
I also would agree, that rework could make things worse, depending on how
densely the assembly is packed and what other components are ear the 0805's.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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