Howard,

It might be that the reverse order of application would be acceptable for a wire bond?
Is this an "all gold board"?
The tab plater would likely sheer the immersion gold off anyway?

                        Paul Wilson
        R&D Manager / Plant Chemist

                   Circuit Center, Inc.
                 4738 Gateway Circle
                  Dayton, OH 45440

          Phone (937) 435-2131     Fax (937) 435-7698
            http://www.circuitcenter.com

-----Original Message-----
From:   Howard Lin [SMTP:[log in to unmask]]
Sent:   Wednesday, March 03, 1999 12:07 AM
To:     [log in to unmask]
Subject:        [TN] Two kinds of surface finish

Dear All,
I got one inquiry from our customer on two kinds of surface finisf for
one board. They need both immersion gold and hard gold plating. Can I
dirctly apply hard gold plating over immersion gold on gold finger area?
Is there any quality issue that I should concern?
I am very appreciated  for any input.
Regards,

Howard
Maxedge Electronic Corp.
[log in to unmask]

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