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March 1999

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 30 Mar 1999 08:02:41 EST
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Hi Edward,
I have to agree with Gunter; I have seen little in terms of reliability data
for lead-free solders. And what I have seen does not give me much confidence,
since the cyclic tests were designed—for expedience's sake— without adequate
dwell times at the temperature extremes and therefore, by design, totally
neglect the most crucial reliability property of soft solders—creep—which
increases the cyclic fatigue damage and shortens fatigue life. Soft solders,
in order to be practical, will all have homologeous temperatures that are very
similar; thus, their fatigue behaviour should not be dramatically different.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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