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March 1999

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Subject:
Via in pad technology
From:
"Beckman, Michael W" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 31 Mar 1999 08:54:29 -0800
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text/plain
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text/plain (23 lines) 
All,
Does anyone out there have any reliable info on Via in pad technology in
.040mil and .062mil thk FR-4?
Has anyone used Via in pad for 20 mil BGA lands same thickness?
These BGA designs are getting so tight we need some relief!
Am looking for design rules and capability for high volume manufacturing.
Thanks,
Mike Beckman
ATD DPD Design Integration
[log in to unmask]

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