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March 1999

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Subject:
Solder Filled Vias - Motorola PLD 1.5 Power Surface Mount Packag
From:
John Parsons <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Mar 1999 09:50:13 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines) 
Good Morning,

Does anyone, fab shops to designers, have any experience with
designing, manufacturing or end use of solder filled vias for thermal
management as detailed in Motorola's App Note AN4005/D

Any information including problems encountered or tips would be
appreciated.

Regards

John Parsons
Circuit Graphics Ltd.

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