Hi Phil,
Plastic components should not be subjected to processes which contain
halides.  I believe most tin/lead strippers contain fluorine or chlorine
which are considered a no-no as far as package reliability is concerned.
All you need is a little moisture to drive the halides to the die
surface where they will corrode the aluminum bond pads.

In addition, you would probably need a layer of immersion nickel under
the immersion gold so this concept is getting very complicated.

Regards, Russ Winslow

Six Sigma
1940 Concourse Drive
San Jose, CA  95131

[log in to unmask]
http://www.sixsigmaservices.com






-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Hersey
Sent: Wednesday, March 24, 1999 3:09 PM
To: [log in to unmask]
Subject: [TN] SMT, replace solder with conductive epoxy?


What if... you took all your standard SMD devices, threw them in an
etchant
to get rid of the tin/lead, immediately took them out and threw them in
an
immersion "flash" gold bath, then used conductive epoxy to mount them to
a
flash gold/nickel PCB rather then solder?

Does this seem feasible? (technically at least)

Resp.
Phil Hersey, Carson City Nevada USA

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