TECHNET Archives

March 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Supeplasticity
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Mar 1999 14:32:34 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines) 
Michael

- No, my papers are not yet postet on a web page ( too much work, maybe too
lazy )
- I am working at the Swiss Federal Institute for Materials Testing and
Research. This is not a company but a research institute which is part of
the Swiss Polytech in Zurich ( ETHZ ).
- The 2% silver have their reason in the Ag/Pa connectors of some SMT
components. The silver in the solder is supposed to slow down the
dissolution rate of the connector's silver. Metallurgically Sn62Pb36Ag2 is
a ternary alloy with a somewhat lower melting point than the binary
tin/lead eutectic.


Best regards

Guenter

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2