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March 1999

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Tue, 2 Mar 1999 15:33:50 -0600
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We've talked about this before and other mechanisms effecting defect in chip devices. The company
I'm now with goes to a little extreme - though having researched this over the years. They even use
0402 pads and dimensions to mount, reflow, and operate 0603's.

There will be a change when moving to wave solderable, glue mounted 0603 types to allow dispensing.
However, we use smaller pads to ensure smaller fillets to ensure fewer cracked devices and longer
term reliability.

Earl Moon

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