Can anyone help with recommendations for ionic contamination
     specifications of rigid and flexible circuits. I am responsible for
     the manufacture of electronic assemblies both flexible and rigid.

     Rigid    - 2oz Copper(double sided)
     Flexible - 20z copper/mylar laminate (single sided)

     3 of the flexible circuits are operated in Static Positions and 1
     operates in a dynamic position (specification of 5K+ flexing cycles)

     Also if there is a web site which may contain some of this information
     I would appreciate the address?

     Being new to ionic contamination I guess the specification is aimed at
     protection from possible micro etching agents etc. which effect Early
     Life failure rates - is this correct?

     Thank you for your time and support in advance.

     Colin Leyden
     Senior Engineer

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################