Hello Guenter-

Are your company's papers posted on a web page? Also, what is your company's
full name? I've always been curious about the actual (and imagined)
differences when 2% silver is included in (near-)eutectic solder alloy
[cosmetic appearance of final joint, fatigue life, microstructure, wetting
characteristics, etc.]

Thanks,

Michael Alderete



Guenter wrote...
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Date:    Thu, 25 Mar 1999 09:35:33 +0100
From:    Guenter Grossmann <[log in to unmask]>
Subject: Re: Superplasticity of Sn-40Pb solder

Hi Tamara


Just some references:


Rawal/Murti     Some Observations on Superplasticity

                in the Sn-Pb Eutectic                           1972


Melton/Langdon  Anisotropy during superplastic deformation

                of the Sn-Pb eutectic alloy                     1975


Hariuchi        On the effective stress dependence of

                steady state creep rate in SN-Pb eutectic       1974


Mohammed/Langdon Creep behaviour in the superplastic Pb-62Sn    1975

                 eutectic


Knecht/Fox      Constitutive relation and creep fatigue

                life model for eutectic tin lead solder         1990


Solomon         Creep,strainrate sensitivity and low

                cycle fatigue of 60/40 solder                   1986


Darvaux         Constitutive relations for tin-based

                solder joints                                   1992


And please don't get mad if I add some references from our lab:


L.Weber         Creep fatigue behaviour of eutectic

                Sn62Pb36Ag2 solder                              1997


Grossmann       Mechanical Properties of Sn62Pb36Ag2

                ( German )                                      1998


                Properties of thin layers of

                Sn62Pb36Ag2                                     1995


                Metallurgical considerations for

                accelerated testing of electronic

                equippment                                      1997


                Lifetime assessment of soft solder joints

                on the base of the metallurgical behaviour

                of Sn62Pb36Ag2                                  1997


                The deformation behaviour of Sn62Pb36Ag2

                and its implications on the design of thermal

                cycling tests for electronic assemblies         1999


Sorry that I couldn't resist to show what we did.




Best regards


Guenter

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