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Date: | Wed, 24 Mar 1999 17:01:26 -0800 |
Content-Type: | multipart/mixed |
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Kathy,
I can't speak much to the silver migration issue, but I whole-heartedly
concur with Steve's comments regarding manufacturability. We've used these
parts extensively on boards we build for several customers, and have found a
significant increase in shorts on the convex parts.
Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065
+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy Palumbo
> Sent: Wednesday, March 24, 1999 9:16 AM
> To: [log in to unmask]
> Subject: [TN] Silver Migration
>
>
> Can anyone help me?
>
> I have been told by a chip component manufacturer that the reason they
> changed the pin out on a resistor network from a concave to a
> convex was
> because it allowed them to place the pin terminations farther
> away from one
> another, which in turn helped to reduce the issue of silver migration.
>
> My questions are:
>
> 1. What are the conditions that silver migration can occur?
>
> 2. Could these conditions be present in chip components, particulary
> resistor array networks?
>
> 3. Has anyone ever heard of this or had issues with this?
>
> 4. Is there any supporting research to back this claim?
>
> Thanks in advance for you support.
>
> Kathy Palumbo
>
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