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March 1999

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Subject:
From:
Rick Thompson <[log in to unmask]>
Reply To:
Date:
Wed, 24 Mar 1999 17:01:26 -0800
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Kathy,

I can't speak much to the silver migration issue, but I whole-heartedly
concur with Steve's comments regarding manufacturability.  We've used these
parts extensively on boards we build for several customers, and have found a
significant increase in shorts on the convex parts.

Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy Palumbo
> Sent: Wednesday, March 24, 1999 9:16 AM
> To: [log in to unmask]
> Subject: [TN] Silver Migration
>
>
> Can anyone help me?
>
> I have been told by a chip component manufacturer that the reason they
> changed the pin out on a resistor network from a concave to a
> convex was
> because it allowed them to place the pin terminations farther
> away from one
> another, which in turn helped to reduce the issue of silver migration.
>
> My questions are:
>
> 1.  What are the conditions that silver migration can occur?
>
> 2.  Could these conditions be present in chip components, particulary
> resistor array networks?
>
> 3.  Has anyone ever heard of this or had issues with this?
>
> 4.  Is there any supporting research to back this claim?
>
> Thanks in advance for you support.
>
> Kathy Palumbo
>
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