I am chronically failing RGA (residual gas analysis) despite several hours
of vacuum bake.  I vaguely remember from my sputtering days that vacuum
alone is not the best way to remove moisture - vacuum dep. machines use a
"nitrogen trap".

Does anyone know of better ways than vac. bake to remove H2O from PCB
assemblies which will later be hermetically sealed and tested for RGA?

Resp.
Phil Hersey, Carson City Nevada USA

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