Kathy,

First let me thank you for all the DEK help. Great stuff and we're going ProFlow. Plus, the Brit's
are flying over, next month, a brand new Autoflex support pin plate resplendent with brand shiney
new tooling pins without some other not needed stuff. This is supposed to solve our breakage
problems you don't experience without Autoflex.

Regarding silver, Jonathan forces my hand to date some of the experiences I hardly remember but are
worth a re-visit. As he says, silver migration has always been a problem dating from my days
designing and building hybrid thick film circuitry. For the reasons he states, though an excellent
electrical conductor, it must be carefully considered and used.

We went from silver to palladium silver compositions to resolve the issue - somewhat. Today's
"flash" - electrolessly deposited PCB and part silver conductor coatings work well because of small
amounts applied. No matter, silver still maintains its ability to migrate while acting as an
excellent conductor. In small deposition amounts, with adequate conductor spacing while assuring
effective dissolution in a solder medium, it behaves rather well. It can be managed.

The circle continues revolving. What comes around is nothing much new except about how to re-
formulate and use the same old stuff. One day a breakthough will occur and we'll all be on the
floor, though hopefully of the specified but well cushioned ESD variety.

Best Wishes,

Earl Moon

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