TECHNET Archives

March 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Tamir Ben-shushan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Mar 1999 08:22:36 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Hello,
The application is a 'SHELLCASE' package which made of a kind of glass with
CTE of a bout 4ppm.
I would like to know some popular materials used in the PCB's industry which
compatible regarding the CTE and conventional assembly process.

Tanks In Advance.
----------------------------------------------------------------------------
---------------------------------

Tamir Ben Shoshan                / \    Tel   : 972-9-9597-366
Senior Technology Engineer    \ /    Fax   : 972-9-9502-922
Engineering Department         // \\
Scitex Corporation Ltd.                   Email :
[log in to unmask]
Pob 330 Herzlia, Israel                  WEB   : www.scitex.com
----------------------------------------------------------------------------
---------------------------------

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2